Surfect Technologies
Surfect provides advanced interconnect and packaging solutions for Solar Cell, LED and Power Management applications. Surfect’s Smart Solutions™ help producers of solar cells and modules lower their production costs and achieve greater efficiency.
Surfect’s unique plating process is based on a proprietary Direct Energy Plating™ technology, which uses ultrasonic energy to create the metal interconnect on the silicon wafers that are the heart of semiconductor and solar cells applications.
Our single-cell plating tools improve the speed and quality of wafer metallization and improve cell conversion efficiency – at a significantly reduced cost. The tools are computer-driven, simple to operate, and can accommodate multiple chemistries.
The flexibility of our DEP™ tool platform allows solar and semiconductor producers to incrementally scale production volume, which means they can reduce capital intensity, preserve high utilization and optimize ROIC.